EP2AGZ300FF35I3G vs EP2AGZ300FF35I4 Comparaison
Comparaison détaillée côte à côte de EP2AGZ300FF35I3G par Intel et EP2AGZ300FF35I4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGZ300FF35I3G | EP2AGZ300FF35I4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 230,00 | $1 015,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300000 | — |
| Number of User I/O | 554 (maximum) | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Process Node | 40 nm | — |
| Température de fonctionnement | -40C to +100 C (I3 industrial) | — |
| Boîtier | 1152-ball FBGA (FF35) | 1152-ball FC-FBGA (FF35) |
| Type de montage | Surface Mount | Surface Mount (flip-chip BGA) |
| Tension d'alimentation | [DATA_NEEDED: core and I/O supply voltage values] | — |
| Embedded Memory (Mbits) | 16.4 | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | Hard DSP columns (variable precision) |
| PLLs | [DATA_NEEDED: number of PLLs] | — |
| Memory Interfaces | DDR3, QDRII+, RLDRAM II | — |
| Configuration Method | Serial, Parallel, JTAG | — |
| Statut RoHS | Compliant | Compliant |
| Niveau MSL | 3 (168 hours) | — |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | — | 11,920 |
| Maximum User I/O | — | 554 |
| Operating Frequency (Max) | — | 500 MHz |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | — | 1152 |
| Terminal Form | — | Ball (BGA) |
| Transceivers | — | 12.5 Gbps integrated |
| Embedded Memory | — | M20K blocks (distributed) |
| PCIe Support | — | PCIe Gen2 hard IP |