EP2AGZ300FH29C4G vs EP2AGZ350FH29C4G Vergleich

Detaillierter Direktvergleich von EP2AGZ300FH29C4G von Intel und EP2AGZ350FH29C4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FH29C4G EP2AGZ350FH29C4G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.700,00 $2.205,00
Series Arria II GZ —
Logic Elements 300,000 (approx.) —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Total RAM Bits [DATA_NEEDED: embedded memory bits] —
Number of I/O [DATA_NEEDED: max user I/O count] —
Number of Transceivers [DATA_NEEDED: transceiver count and rate] —
Number of Multipliers (18x18) [DATA_NEEDED: DSP block count] —
Voltage - Supply [DATA_NEEDED: core and I/O supply rails] —
Betriebstemperatur 0C to +85C (commercial grade, suffix C) 0C to +85C (Commercial)
Grade C4 (commercial, speed grade 4) —
Montageart Surface Mount Surface Mount (BGA)
Gehäuse / Bauform 780-BGA (Fine-pitch BGA, FH29) —
MSL-Level [DATA_NEEDED: MSL moisture sensitivity level] —
RoHS-Status Compliant Compliant
Process Technology 40 nm —
Lead-Free Yes Yes
Manufacturer Intel (formerly Altera) —
Family — Arria II GZ
Logic Elements (LEs) — 350,000
M20K Block RAM (bits) — 18,424 Kbits
MLAB Memory (bits) — 1,425 Kbits
Embedded Multipliers (18x18) — 1,152
Transceivers — 16 (8.5 Gbps)
Maximum User I/O — 552
Gehäuse — 780-ball Flip-Chip BGA (FH29)
Process Node — 40 nm
Speed Grade — C4
Transceiver Grade — -4

Datenblätter & Ressourcen

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