EP2AGZ300FH29C4G vs EP2AGZ350FH29C4G Comparación
Comparación detallada lado a lado de EP2AGZ300FH29C4G por Intel y EP2AGZ350FH29C4G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FH29C4G | EP2AGZ350FH29C4G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.700,00 | $2.205,00 |
| Series | Arria II GZ | — |
| Logic Elements | 300,000 (approx.) | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | [DATA_NEEDED: embedded memory bits] | — |
| Number of I/O | [DATA_NEEDED: max user I/O count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count and rate] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: DSP block count] | — |
| Voltage - Supply | [DATA_NEEDED: core and I/O supply rails] | — |
| Temperatura de funcionamiento | 0C to +85C (commercial grade, suffix C) | 0C to +85C (Commercial) |
| Grade | C4 (commercial, speed grade 4) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 780-BGA (Fine-pitch BGA, FH29) | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Estado RoHS | Compliant | Compliant |
| Process Technology | 40 nm | — |
| Lead-Free | Yes | Yes |
| Manufacturer | Intel (formerly Altera) | — |
| Family | — | Arria II GZ |
| Logic Elements (LEs) | — | 350,000 |
| M20K Block RAM (bits) | — | 18,424 Kbits |
| MLAB Memory (bits) | — | 1,425 Kbits |
| Embedded Multipliers (18x18) | — | 1,152 |
| Transceivers | — | 16 (8.5 Gbps) |
| Maximum User I/O | — | 552 |
| Encapsulado | — | 780-ball Flip-Chip BGA (FH29) |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 |
| Transceiver Grade | — | -4 |