EP2AGZ300FH29I3G vs EP2AGZ300FH29C4G Vergleich

Detaillierter Direktvergleich von EP2AGZ300FH29I3G von Intel und EP2AGZ300FH29C4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FH29I3G EP2AGZ300FH29C4G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.340,00 $1.700,00
Product Type Field Programmable Gate Array (FPGA) —
Family Arria II GZ —
Logic Elements (LE) 300,000 —
Embedded Memory 18,520 Kbits —
DSP Blocks (18x18 multipliers) 720 —
Maximum Transceiver Data Rate 6.375 Gbps —
Number of Transceivers 24 [DATA_NEEDED: transceiver count and rate]
Process Node 40 nm TSMC —
Gehäuse 780-pin FineLine BGA (FH29), 29x29 mm —
Speed Grade -3 —
Temperature Grade Industrial (-40C to +100C) —
Operating Voltage (Core) 0.9 V —
External Memory Interface DDR3 up to 800 MHz —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant Compliant
Series — Arria II GZ
Logic Elements — 300,000 (approx.)
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Total RAM Bits — [DATA_NEEDED: embedded memory bits]
Number of I/O — [DATA_NEEDED: max user I/O count]
Number of Multipliers (18x18) — [DATA_NEEDED: DSP block count]
Voltage - Supply — [DATA_NEEDED: core and I/O supply rails]
Betriebstemperatur — 0C to +85C (commercial grade, suffix C)
Grade — C4 (commercial, speed grade 4)
Gehäuse / Bauform — 780-BGA (Fine-pitch BGA, FH29)
MSL-Level — [DATA_NEEDED: MSL moisture sensitivity level]
Process Technology — 40 nm
Lead-Free — Yes
Manufacturer — Intel (formerly Altera)

Datenblätter & Ressourcen

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