EP2AGZ300FH29I3G vs EP2AGZ300FH29I3N Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I3G von Intel und EP2AGZ300FH29I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I3G | EP2AGZ300FH29I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.340,00 | $1.380,00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300,000 | — |
| Embedded Memory | 18,520 Kbits | 18,854,912 bits |
| DSP Blocks (18x18 multipliers) | 720 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | 24 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Gehäuse | 780-pin FineLine BGA (FH29), 29x29 mm | 780-FCBGA (H-BGA, 29x29 mm) |
| Speed Grade | -3 | I3 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Operating Voltage (Core) | 0.9 V | — |
| External Memory Interface | DDR3 up to 800 MHz | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| User I/O Pins | — | 281 |
| Transceivers | — | 12 |
| Max Transceiver Speed | — | 6.375 Gbps |
| Core Voltage | — | 0.9 V |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| PLLs | — | 8 (4 general-purpose + 4 transceiver) |
| Global Clock Networks | — | 16 |
| Lebenszyklusstatus | — | End of Life (EOL) |