EP2AGZ300FH29I4G vs EP2AGZ300FH29I4N Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I4G von Intel und EP2AGZ300FH29I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I4G | EP2AGZ300FH29I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.350,00 | $1.380,00 |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | BGA / FC-HFBGA |
| Betriebstemperaturbereich | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | — |
| Process Node | 40 nm TSMC | — |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | — |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | Yes |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory Bits | — | 18,854,912 |
| User I/Os | — | 281 |
| Operating Frequency (max) | — | 500 MHz |
| Process Technology | — | 40 nm CMOS |
| Core Supply Voltage | — | 0.9 V |
| Gehäuse | — | 780-ball FCBGA (FH29) |
| Operating Temperature Grade | — | Industrial (I4 speed/temperature grade) |
| Number of Cells | — | 298,000 |