EP2AGZ300FH29I4G vs EP2AGZ300FH29I4N Comparación
Comparación detallada lado a lado de EP2AGZ300FH29I4G por Intel y EP2AGZ300FH29I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FH29I4G | EP2AGZ300FH29I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.350,00 | $1.380,00 |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | BGA / FC-HFBGA |
| Rango de temperatura de funcionamiento | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | — |
| Process Node | 40 nm TSMC | — |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | — |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | Yes |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory Bits | — | 18,854,912 |
| User I/Os | — | 281 |
| Operating Frequency (max) | — | 500 MHz |
| Process Technology | — | 40 nm CMOS |
| Core Supply Voltage | — | 0.9 V |
| Encapsulado | — | 780-ball FCBGA (FH29) |
| Operating Temperature Grade | — | Industrial (I4 speed/temperature grade) |
| Number of Cells | — | 298,000 |