EP2AGZ300HF40C3G vs EP2AGZ300HF40I3N Vergleich
Detaillierter Direktvergleich von EP2AGZ300HF40C3G von Intel und EP2AGZ300HF40I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300HF40C3G | EP2AGZ300HF40I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.950,00 | $3.820,00 |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | 298,000 |
| User I/O Count | 734 | 734 |
| Gehäuse | 1517-ball FBGA | 1517-BBGA, FCBGA (HF40) |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Betriebstemperatur | Commercial (0C to +85C) | — |
| Embedded Memory | Approx. 18.7 Mbits | — |
| DSP Blocks | 800+ (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| RoHS-Status | Pb-free finish - compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Family | — | EP2AGZ |
| Embedded Memory Bits | — | 18,854,912 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 0.9 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Number of PLLs | — | 4 |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | AES-256 |