EP2AGZ300HF40C3G vs EP2AGZ300HF40I3N 对比
详细并排对比 EP2AGZ300HF40C3G 出自 Intel 和 EP2AGZ300HF40I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGZ300HF40C3G | EP2AGZ300HF40I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5,950.00 | $3,820.00 |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | 298,000 |
| User I/O Count | 734 | 734 |
| 封装 | 1517-ball FBGA | 1517-BBGA, FCBGA (HF40) |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| 工作温度 | Commercial (0C to +85C) | — |
| Embedded Memory | Approx. 18.7 Mbits | — |
| DSP Blocks | 800+ (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| RoHS 状态 | Pb-free finish - compliant | Compliant |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Family | — | EP2AGZ |
| Embedded Memory Bits | — | 18,854,912 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 0.9 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Number of PLLs | — | 4 |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | AES-256 |