EP2AGZ300HF40I4 vs EP2AGZ300HF40I3N Vergleich
Detaillierter Direktvergleich von EP2AGZ300HF40I4 von Intel und EP2AGZ300HF40I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300HF40I4 | EP2AGZ300HF40I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.925,00 | $3.820,00 |
| Series | Arria II GZ | Arria II GZ |
| Family | Field-Programmable Gate Array (FPGA) | EP2AGZ |
| Manufacturer | Intel (formerly Altera) | — |
| Process Node | 40 nm | — |
| Logic Elements | 298,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 18,854,912 bits (18.85 Mbit) | — |
| Block RAM | 19,200 Kbits | — |
| Number of Logic Cells | 298,000 | — |
| Maximum User I/O Pins | 1192 | — |
| Number of Transceivers | Up to 24 | — |
| Transceiver Data Rate (max) | 6.375 Gbps (CPRI/OBSAI) | — |
| Number of PLLs | 8 | 4 |
| Core Voltage | 0.9 V (1.1 V option via SmartVoltage IDM) | — |
| Core Performance (max) | 500 MHz | — |
| Number of Global Clock Networks | 16 | — |
| Package Type | 1517-ball FC-FBGA | — |
| Operating Temperature Grade | Industrial (I4): -40C to +100C | Industrial (-40C to +100C) |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 298,000 |
| Embedded Memory Bits | — | 18,854,912 |
| User I/O Count | — | 734 |
| Gehäuse | — | 1517-BBGA, FCBGA (HF40) |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 0.9 V |
| Process Technology | — | 40 nm |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | AES-256 |