EP2AGZ300HF40I4 vs EP2AGZ300HF40I3N Comparación
Comparación detallada lado a lado de EP2AGZ300HF40I4 por Intel y EP2AGZ300HF40I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300HF40I4 | EP2AGZ300HF40I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.925,00 | $3.820,00 |
| Series | Arria II GZ | Arria II GZ |
| Family | Field-Programmable Gate Array (FPGA) | EP2AGZ |
| Manufacturer | Intel (formerly Altera) | — |
| Process Node | 40 nm | — |
| Logic Elements | 298,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 18,854,912 bits (18.85 Mbit) | — |
| Block RAM | 19,200 Kbits | — |
| Number of Logic Cells | 298,000 | — |
| Maximum User I/O Pins | 1192 | — |
| Number of Transceivers | Up to 24 | — |
| Transceiver Data Rate (max) | 6.375 Gbps (CPRI/OBSAI) | — |
| Number of PLLs | 8 | 4 |
| Core Voltage | 0.9 V (1.1 V option via SmartVoltage IDM) | — |
| Core Performance (max) | 500 MHz | — |
| Number of Global Clock Networks | 16 | — |
| Package Type | 1517-ball FC-FBGA | — |
| Operating Temperature Grade | Industrial (I4): -40C to +100C | Industrial (-40C to +100C) |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 298,000 |
| Embedded Memory Bits | — | 18,854,912 |
| User I/O Count | — | 734 |
| Encapsulado | — | 1517-BBGA, FCBGA (HF40) |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 0.9 V |
| Process Technology | — | 40 nm |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | AES-256 |