EP2AGZ350FH29C3N vs EP2AGZ350FH29C3G Vergleich
Detaillierter Direktvergleich von EP2AGZ350FH29C3N von Intel und EP2AGZ350FH29C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ350FH29C3N | EP2AGZ350FH29C3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.920,00 | $1.350,00 |
| Family | Arria II GZ | — |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | — |
| Embedded Memory (bits) | 21,270,528 | — |
| Number of LABs/CLBs | 13,940 | — |
| User I/O Count | 281 | — |
| Gehäuse | 780-BBGA, FCBGA (FH29) | 780-ball FBGA (HBGA, 29x29 mm) |
| Number of Pins / Terminals | 780 | — |
| Speed Grade | C3 | C3 (commercial, slowest) |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Voltage - Supply | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Process Node | 40 nm | 40 nm TSMC |
| Logic Elements | — | 350,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Bits) | — | 16,402,944 |
| Embedded Memory Blocks | — | [DATA_NEEDED: M9K/M144K block count] |
| User I/O Pins | — | 281 |
| Transceivers | — | 24 channels |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| PCI Express Hard IP | — | 4 x PCIe Gen2 (x1/x4) |
| External Memory Interface | — | DDR3 up to 800 MHz, DDR2, QDRII+ |
| PLLs | — | 8 (4 enhanced, 4 fast) |
| Global Clocks | — | 16 |
| Betriebs-Sperrschichttemperatur | — | 0C to +85C |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |