EP2AGZ350FH29C3N vs EP2AGZ350FH29C3G Comparación
Comparación detallada lado a lado de EP2AGZ350FH29C3N por Intel y EP2AGZ350FH29C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350FH29C3N | EP2AGZ350FH29C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.920,00 | $1.350,00 |
| Family | Arria II GZ | — |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | — |
| Embedded Memory (bits) | 21,270,528 | — |
| Number of LABs/CLBs | 13,940 | — |
| User I/O Count | 281 | — |
| Encapsulado | 780-BBGA, FCBGA (FH29) | 780-ball FBGA (HBGA, 29x29 mm) |
| Number of Pins / Terminals | 780 | — |
| Speed Grade | C3 | C3 (commercial, slowest) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Voltage - Supply | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Process Node | 40 nm | 40 nm TSMC |
| Logic Elements | — | 350,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Bits) | — | 16,402,944 |
| Embedded Memory Blocks | — | [DATA_NEEDED: M9K/M144K block count] |
| User I/O Pins | — | 281 |
| Transceivers | — | 24 channels |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| PCI Express Hard IP | — | 4 x PCIe Gen2 (x1/x4) |
| External Memory Interface | — | DDR3 up to 800 MHz, DDR2, QDRII+ |
| PLLs | — | 8 (4 enhanced, 4 fast) |
| Global Clocks | — | 16 |
| Temperatura de unión de funcionamiento | — | 0C to +85C |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |