EP2AGZ350FH29C4G vs EP2AGZ300FH29C4G Vergleich

Detaillierter Direktvergleich von EP2AGZ350FH29C4G von Intel und EP2AGZ300FH29C4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ350FH29C4G EP2AGZ300FH29C4G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.205,00 $1.700,00
Family Arria II GZ —
Logic Elements (LEs) 350,000 —
M20K Block RAM (bits) 18,424 Kbits —
MLAB Memory (bits) 1,425 Kbits —
Embedded Multipliers (18x18) 1,152 —
Transceivers 16 (8.5 Gbps) —
Maximum User I/O 552 —
Gehäuse 780-ball Flip-Chip BGA (FH29) —
Process Node 40 nm —
Speed Grade C4 —
Betriebstemperatur 0C to +85C (Commercial) 0C to +85C (commercial grade, suffix C)
Transceiver Grade -4 —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant Compliant
Lead-Free Yes Yes
Series — Arria II GZ
Logic Elements — 300,000 (approx.)
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Total RAM Bits — [DATA_NEEDED: embedded memory bits]
Number of I/O — [DATA_NEEDED: max user I/O count]
Number of Transceivers — [DATA_NEEDED: transceiver count and rate]
Number of Multipliers (18x18) — [DATA_NEEDED: DSP block count]
Voltage - Supply — [DATA_NEEDED: core and I/O supply rails]
Grade — C4 (commercial, speed grade 4)
Gehäuse / Bauform — 780-BGA (Fine-pitch BGA, FH29)
MSL-Level — [DATA_NEEDED: MSL moisture sensitivity level]
Process Technology — 40 nm
Manufacturer — Intel (formerly Altera)

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