EP2AGZ350FH29I3G vs EP2AGZ300FH29I3G Vergleich

Detaillierter Direktvergleich von EP2AGZ350FH29I3G von Intel und EP2AGZ300FH29I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ350FH29I3G EP2AGZ300FH29I3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.450,00 $1.340,00
Family Arria II GZ Arria II GZ
Logic Elements (LE) 350000 (approximately) 300,000
Process Node 40 nm 40 nm TSMC
User I/O Count 281 —
Gehäuse 780-FBGA (FineLine BGA, FH29) 780-pin FineLine BGA (FH29), 29x29 mm
Temperature Grade Industrial (-40C to +100C) Industrial (-40C to +100C)
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperaturbereich -40C to +100C —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceivers Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) —
Memory Interface DDR3 with read/write leveling support (family feature) —
Embedded Multipliers 18x18 hardware multipliers (family feature) —
Configuration Method Serial or parallel via Quartus II (family feature) —
MSL-Level 3 (per BGA package handling guidelines) —
RoHS-Status Compliant Compliant
Lead Free Yes —
Halogenfrei [DATA_NEEDED: halogen free status] —
Product Type — Field Programmable Gate Array (FPGA)
Embedded Memory — 18,520 Kbits
DSP Blocks (18x18 multipliers) — 720
Maximum Transceiver Data Rate — 6.375 Gbps
Number of Transceivers — 24
Speed Grade — -3
Operating Voltage (Core) — 0.9 V
External Memory Interface — DDR3 up to 800 MHz

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