EP2AGZ350FH29I3G vs EP2AGZ300FH29I3N Vergleich

Detaillierter Direktvergleich von EP2AGZ350FH29I3G von Intel und EP2AGZ300FH29I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2AGZ300FH29I3N EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel

EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel

EP2AGZ300FH29I3N ✗ Abgekündigt

Spezifikationsvergleich

Parameter EP2AGZ350FH29I3G EP2AGZ300FH29I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.450,00 $1.380,00
Family Arria II GZ Arria II GZ
Logic Elements (LE) 350000 (approximately) —
Process Node 40 nm 40 nm
User I/O Count 281 —
Gehäuse 780-FBGA (FineLine BGA, FH29) 780-FCBGA (H-BGA, 29x29 mm)
Temperature Grade Industrial (-40C to +100C) —
Montageart Surface Mount Surface Mount
Betriebstemperaturbereich -40C to +100C —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceivers Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) 12
Memory Interface DDR3 with read/write leveling support (family feature) —
Embedded Multipliers 18x18 hardware multipliers (family feature) —
Configuration Method Serial or parallel via Quartus II (family feature) —
MSL-Level 3 (per BGA package handling guidelines) —
RoHS-Status Compliant Compliant
Lead Free Yes —
Halogenfrei [DATA_NEEDED: halogen free status] —
Logic Elements — 298,000
Logic Array Blocks (LABs) — 11,920
Embedded Memory — 18,854,912 bits
User I/O Pins — 281
Max Transceiver Speed — 6.375 Gbps
Core Voltage — 0.9 V
Speed Grade — I3
Betriebstemperatur — -40C to +100C (Industrial)
PLLs — 8 (4 general-purpose + 4 transceiver)
Global Clock Networks — 16
Lebenszyklusstatus — End of Life (EOL)

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