EP2AGZ350HF40C3N vs EP2AGZ300HF40C3N Vergleich
Detaillierter Direktvergleich von EP2AGZ350HF40C3N von Intel und EP2AGZ300HF40C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ350HF40C3N | EP2AGZ300HF40C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.150,00 | $3.623,45 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 298,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | 13,940 | 11,920 |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Up to 24 (per family datasheet) | Up to 12 channels |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.375 Gbps |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm low-power | 40 nm |
| Gehäuse | 1517-ball FCBGA (HF40) | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Montageart | Surface Mount (flip-chip BGA) | — |
| Total Memory Bits | — | 18,854,912 bits (~18.85 Mbit) |
| Embedded Multipliers (18x18) | — | 736 |
| Maximum User I/O | — | 734 |
| Betriebstemperatur | — | 0C to +85C (Commercial) |
| Memory Interface Support | — | DDR3-800, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | PCI Express Gen1 / Gen2 |
| PLL Type | — | Fractional PLL + Multiplier PLL |
| RoHS-Status | — | Compliant |
| Lebenszyklusstatus | — | Obsolete (NRND/EOL per Intel) |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Design Software | — | Quartus II (legacy) |