EP2C35F484C6 vs EP2C35F484I6N Vergleich

Detaillierter Direktvergleich von EP2C35F484C6 von Intel und EP2C35F484I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C35F484C6 EP2C35F484I6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $57,20 $52,10
Family Cyclone II —
Logic Elements (LE) 33,216 —
Embedded Memory Bits 483,840 bits (105 M4K blocks x 4 Kbit) —
Embedded 18x18 Multipliers 35 35 (Cyclone II family maximum 150)
Maximum User I/O 322 —
Process Technology 90 nm low-k CMOS —
Core Voltage (VCCINT) 1.2 V —
PLL Analog Supply (VCCA) 2.5 V —
I/O Standards LVTTL, LVCMOS (1.5/1.8/2.5/3.3 V), SSTL, HSTL, PCI, differential LVDS, RSDS —
Gehäuse 484-ball FineLine BGA (FBGA) 484-ball FBGA (Fine-Pitch BGA)
Speed Grade -6 —
Operating Temperature (Commercial) 0 C to +85 C —
PLLs 4 —
Global Clock Networks 16 —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
RoHS-Status Compliant Compliant
Lead-Free Yes —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Logic Elements — 33,216
Logic Array Blocks (LABs) — 2,100
Total RAM Bits — 483,840 bits (483.84 Kbit on-chip)
Phase-Locked Loops (PLLs) — 4
Maximum User I/O Pins — 322 (package-dependent; FBGA-484 supports up to 322 user I/O)
Logic Family — CMOS
Core Supply Voltage — 1.2 V
Betriebstemperaturbereich — -40C to +85C (industrial)
Maximum Internal Clock Frequency — 402.5 MHz
Process Node — 90 nm TSMC CMOS
Configuration Method — Serial / Parallel (via Altera/Intel configuration device or JTAG)

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