EP2C35F484I6N vs EP2C35F484C7 Vergleich

Detaillierter Direktvergleich von EP2C35F484I6N von Intel und EP2C35F484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C35F484I6N EP2C35F484C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $52,10 $54,25
Logic Elements 33,216 33,216 LE
Logic Array Blocks (LABs) 2,100 —
Total RAM Bits 483,840 bits (483.84 Kbit on-chip) —
Embedded 18x18 Multipliers 35 (Cyclone II family maximum 150) —
Phase-Locked Loops (PLLs) 4 —
Maximum User I/O Pins 322 (package-dependent; FBGA-484 supports up to 322 user I/O) —
Gehäuse 484-ball FBGA (Fine-Pitch BGA) 484-pin FBGA (FineLine BGA)
Logic Family CMOS —
Core Supply Voltage 1.2 V —
Betriebstemperaturbereich -40C to +85C (industrial) —
Maximum Internal Clock Frequency 402.5 MHz —
Process Node 90 nm TSMC CMOS —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant —
Configuration Method Serial / Parallel (via Altera/Intel configuration device or JTAG) —
Series — Cyclone II
Manufacturer — Intel (formerly Altera)
Total Memory Bits — 483,840 bits
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Embedded Multipliers (18x18) — 35
Maximum User I/O — 322
Number of PLLs — 4
Global Clock Networks — 16
Process Technology — 90 nm CMOS, 1.2 V core
Core Voltage — 1.2 V
Betriebstemperatur — 0 C to 85 C (Commercial)
Configuration Modes — JTAG, Passive Serial (PS), Active Serial (AS)
I/O Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
External Memory Support — DDR, DDR2, QDRII SRAM
Lead-Free / RoHS — Lead-Free (per 'N' suffix not present; C7 = commercial temp)

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