EP2C35F484I6N vs EP2C35F484C7N Vergleich
Detaillierter Direktvergleich von EP2C35F484I6N von Intel und EP2C35F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C35F484I6N | EP2C35F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,10 | $85,20 |
| Logic Elements | 33,216 | — |
| Logic Array Blocks (LABs) | 2,100 | — |
| Total RAM Bits | 483,840 bits (483.84 Kbit on-chip) | — |
| Embedded 18x18 Multipliers | 35 (Cyclone II family maximum 150) | 35 |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/O Pins | 322 (package-dependent; FBGA-484 supports up to 322 user I/O) | — |
| Gehäuse | 484-ball FBGA (Fine-Pitch BGA) | 484-ball FBGA (FineLine BGA) |
| Logic Family | CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Betriebstemperaturbereich | -40C to +85C (industrial) | — |
| Maximum Internal Clock Frequency | 402.5 MHz | — |
| Process Node | 90 nm TSMC CMOS | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Configuration Method | Serial / Parallel (via Altera/Intel configuration device or JTAG) | — |
| Family | — | Cyclone II |
| Logic Elements (LEs) | — | 33,216 |
| Total Memory Bits | — | 483,840 bits |
| Embedded Memory (M4K blocks) | — | 105 |
| User I/O Pins | — | 322 |
| Process Technology | — | 90 nm CMOS, SRAM-based |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| PLL Count | — | 4 |
| Global Clock Networks | — | 16 |
| Maximum User Frequency | — | 402 MHz (internal logic) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), PPA |
| Betriebstemperatur | — | 0C to +85C (commercial, 'C7' suffix) |