EP2C35F484I8N vs EP2C35F484I6N Vergleich

Detaillierter Direktvergleich von EP2C35F484I8N von Intel und EP2C35F484I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C35F484I8N EP2C35F484I6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $56,01 $52,10
Series Cyclone II —
Family Cyclone II EP2C35 —
Logic Elements 33,216 33,216
Total RAM Bits 483,840 483,840 bits (483.84 Kbit on-chip)
Number of Logic Cells / Gates 33,216 —
Number of I/O 322 max user I/O —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Embedded Memory 483,840 bits (M4K blocks) —
Number of PLLs 4 —
Gehäuse 484-BGA (FineLine BGA) 484-ball FBGA (Fine-Pitch BGA)
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur -40C to +100C (industrial, I8) —
Process Technology 90 nm CMOS —
Core Voltage 1.2 V (typical) —
Configuration Mode AS / PS / JTAG / FPP —
RoHS-Status Compliant (Pb-free) Compliant
MSL-Level [DATA_NEEDED: MSL level] —
Lead Free Yes —
Logic Array Blocks (LABs) — 2,100
Embedded 18x18 Multipliers — 35 (Cyclone II family maximum 150)
Phase-Locked Loops (PLLs) — 4
Maximum User I/O Pins — 322 (package-dependent; FBGA-484 supports up to 322 user I/O)
Logic Family — CMOS
Core Supply Voltage — 1.2 V
Betriebstemperaturbereich — -40C to +85C (industrial)
Maximum Internal Clock Frequency — 402.5 MHz
Process Node — 90 nm TSMC CMOS
Configuration Method — Serial / Parallel (via Altera/Intel configuration device or JTAG)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern