EP2C35F672I8 vs EP2C35F672C6 Vergleich
Detaillierter Direktvergleich von EP2C35F672I8 von Intel und EP2C35F672C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C35F672I8 | EP2C35F672C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $104,50 | $95,00 |
| Family | Cyclone II | Cyclone II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 33,216 | — |
| Embedded Memory (bits) | 483,840 | — |
| Embedded 18x18 Multipliers | 35 | — |
| User I/O Pins | 475 | — |
| PLLs | 4 | — |
| Process Technology | 90 nm CMOS SRAM | 90 nm CMOS |
| Gehäuse | 672-ball FineLine BGA (FBGA) | — |
| Package Code | F672 | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40C to +100C Tj | — |
| Speed Grade | 8 (C8 core) | C6 |
| Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Supply Voltage (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant (lead-free FBGA) | [DATA_NEEDED: rohs compliance] |
| Logic Elements (LE) | — | 33,216 |
| Total RAM Bits | — | 483,840 |
| Number of I/O | — | 475 |
| Number of Logic Array Blocks (LABs) | — | 2,076 |
| Embedded Multipliers (18x18) | — | 70 |
| Number of PLLs | — | 4 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Gehäuse / Bauform | — | 672-BGA (FBGA) |
| Lead Free | — | [DATA_NEEDED: lead free status] |