EP2C35F672I8 vs EP2C35F672C6 Comparación
Comparación detallada lado a lado de EP2C35F672I8 por Intel y EP2C35F672C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C35F672I8 | EP2C35F672C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $104,50 | $95,00 |
| Family | Cyclone II | Cyclone II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 33,216 | — |
| Embedded Memory (bits) | 483,840 | — |
| Embedded 18x18 Multipliers | 35 | — |
| User I/O Pins | 475 | — |
| PLLs | 4 | — |
| Process Technology | 90 nm CMOS SRAM | 90 nm CMOS |
| Encapsulado | 672-ball FineLine BGA (FBGA) | — |
| Package Code | F672 | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40C to +100C Tj | — |
| Speed Grade | 8 (C8 core) | C6 |
| Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Supply Voltage (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant (lead-free FBGA) | [DATA_NEEDED: rohs compliance] |
| Logic Elements (LE) | — | 33,216 |
| Total RAM Bits | — | 483,840 |
| Number of I/O | — | 475 |
| Number of Logic Array Blocks (LABs) | — | 2,076 |
| Embedded Multipliers (18x18) | — | 70 |
| Number of PLLs | — | 4 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Encapsulado / Carcasa | — | 672-BGA (FBGA) |
| Lead Free | — | [DATA_NEEDED: lead free status] |