EP2C5F256C8N vs EP2C5F256C6N Vergleich
Detaillierter Direktvergleich von EP2C5F256C8N von Intel und EP2C5F256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2C5F256C8N - Cyclone II FPGA, 4.6K LEs, 158 I/O | Altera / Intel
EP2C5F256C8N ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP2C5F256C8N | EP2C5F256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,84 | $11,40 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 4,608 | — |
| Logic Array Blocks (LAB) | 288 | — |
| Embedded Memory (M4K blocks) | 119,808 bits (~14.6 Kbytes) | — |
| Embedded 18x18 Multipliers | 13 | — |
| PLLs | 2 | 2 |
| Maximum User I/O Pins | 158 | — |
| Process Technology | 90 nm low-k CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Speed Grade | 8 (commercial) | — |
| Gehäuse | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA), 17x17 mm, 1.0 mm pitch |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), Passive Serial | JTAG, Active Serial (EPCS) |
| MSL-Level | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | 3 |
| RoHS-Status | Compliant (lead-free) | [DATA_NEEDED: rohs_status] |
| Logic Elements | — | 4,608 |
| Embedded Memory Bits | — | 119,808 bits |
| Embedded Memory Blocks (M4K) | — | 26 blocks of 4,608 bits |
| Maximum User I/Os | — | 158 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Operating Temperature (Commercial, C6) | — | 0C to +85C |