EP2C70F896C7K vs EP2C70F896C8 Vergleich
Detaillierter Direktvergleich von EP2C70F896C7K von Intel und EP2C70F896C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C70F896C7K | EP2C70F896C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,00 | $225,00 |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | — |
| Embedded Memory (M4K blocks) | 4,488 Kbits | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O Pins | 622 | — |
| Maximum User I/O (this package) | [DATA_NEEDED: per F896 pinout] | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 16 | — |
| Process Technology | 90 nm low-power CMOS | 90 nm CMOS SRAM |
| Core Voltage | 1.2 V | — |
| Operating Temperature Grade | Commercial (0C to 85C) | — |
| Gehäuse | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (FBGA-896) |
| Speed Grade | 7 | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 68,416 |
| Total Memory Bits | — | 1,152,000 |
| Number of I/Os | — | 622 |
| Number of LABs/CLBs | — | 4536 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Count | — | 8 banks |
| Package Dimensions | — | 31 x 31 mm |
| Embedded Multipliers | — | 150 (18 x 18) |
| PLLs | — | 4 |
| Maximum User I/O | — | 622 |
| Configuration Method | — | Active Serial / Passive Serial / JTAG |
| Betriebstemperatur | — | Commercial (0C to +85C) |