EP2C70F896C7K vs EP2C70F896C8 Comparación
Comparación detallada lado a lado de EP2C70F896C7K por Intel y EP2C70F896C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C70F896C7K | EP2C70F896C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $178,00 | $225,00 |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | — |
| Embedded Memory (M4K blocks) | 4,488 Kbits | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O Pins | 622 | — |
| Maximum User I/O (this package) | [DATA_NEEDED: per F896 pinout] | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 16 | — |
| Process Technology | 90 nm low-power CMOS | 90 nm CMOS SRAM |
| Core Voltage | 1.2 V | — |
| Operating Temperature Grade | Commercial (0C to 85C) | — |
| Encapsulado | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (FBGA-896) |
| Speed Grade | 7 | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 68,416 |
| Total Memory Bits | — | 1,152,000 |
| Number of I/Os | — | 622 |
| Number of LABs/CLBs | — | 4536 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Count | — | 8 banks |
| Package Dimensions | — | 31 x 31 mm |
| Embedded Multipliers | — | 150 (18 x 18) |
| PLLs | — | 4 |
| Maximum User I/O | — | 622 |
| Configuration Method | — | Active Serial / Passive Serial / JTAG |
| Temperatura de funcionamiento | — | Commercial (0C to +85C) |