EP2C8AF256I8N vs EP2C8AF256A7N Vergleich
Detaillierter Direktvergleich von EP2C8AF256I8N von Intel und EP2C8AF256A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2C8AF256A7N - Cyclone II FPGA, 8K LE, 256-FBGA | Intel / Altera
EP2C8AF256A7N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2C8AF256I8N | EP2C8AF256A7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,40 | $41,50 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 8,256 | 8,256 |
| Embedded Memory Bits | 165,888 bits (162 Kbit RAM) | 165,888 bits (162 Kbit) |
| Embedded Multipliers (18x18) | 36 | — |
| Maximum User I/O Pins | 182 | — |
| PLLs | 4 | 2 |
| Global Clocks | 16 | — |
| Configuration Elements | Embedded SRAM, JTAG, AS, PS | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm TSMC low-k |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (1.0 mm pitch) |
| Betriebstemperatur | -40C to +100C (Industrial, I suffix) | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Lead-free (per Altera ordering code suffix) | Compliant |
| Speed Grade | 8 | 7 (A7) |
| Status Suffix | N (lead-free, Pb-free) | — |
| Embedded RAM Blocks | — | 36 M4K blocks (4 Kbit each) |
| Maximum User I/O | — | 182 |
| I/O Banks | — | 4 |
| Hardware Multipliers (18x18) | — | 18 |
| Maximum Internal Frequency | — | 402.58 MHz |
| Operating Temperature Grade | — | Automotive (A7N) |