EP2C8AF256I8N vs EP2C8AF256A7N Comparación
Comparación detallada lado a lado de EP2C8AF256I8N por Intel y EP2C8AF256A7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2C8AF256A7N - Cyclone II FPGA, 8K LE, 256-FBGA | Intel / Altera
EP2C8AF256A7N ⚠ Última compraComparación de especificaciones
| Parámetro | EP2C8AF256I8N | EP2C8AF256A7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $41,50 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 8,256 | 8,256 |
| Embedded Memory Bits | 165,888 bits (162 Kbit RAM) | 165,888 bits (162 Kbit) |
| Embedded Multipliers (18x18) | 36 | — |
| Maximum User I/O Pins | 182 | — |
| PLLs | 4 | 2 |
| Global Clocks | 16 | — |
| Configuration Elements | Embedded SRAM, JTAG, AS, PS | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm TSMC low-k |
| Encapsulado | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (1.0 mm pitch) |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Lead-free (per Altera ordering code suffix) | Compliant |
| Speed Grade | 8 | 7 (A7) |
| Status Suffix | N (lead-free, Pb-free) | — |
| Embedded RAM Blocks | — | 36 M4K blocks (4 Kbit each) |
| Maximum User I/O | — | 182 |
| I/O Banks | — | 4 |
| Hardware Multipliers (18x18) | — | 18 |
| Maximum Internal Frequency | — | 402.58 MHz |
| Operating Temperature Grade | — | Automotive (A7N) |