EP2C8F256I6N vs EP2C8F256I8N Vergleich

Detaillierter Direktvergleich von EP2C8F256I6N von Intel und EP2C8F256I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C8F256I6N EP2C8F256I8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $22,85 $21,95
Family Cyclone II —
Logic Elements 8,256 —
Logic Array Blocks (LABs) 540 —
Embedded Memory (M4K blocks) 165,888 bits —
Embedded 18 x 18 Multipliers 36 —
Maximum User I/O Pins 182 —
Phase-Locked Loops (PLLs) 4 —
Process Technology 90 nm CMOS 90 nm CMOS (SRAM-based)
Core Supply Voltage 1.2 V (1.15 V min, 1.25 V max) 1.2 V
Maximum Internal Clock Frequency 402.58 MHz —
Speed Grade 6 —
Operating Temperature (Industrial) -40 C to +100 C (Tj) —
Gehäuse 256-ball FineLine BGA (FBGA-256), 1.00 mm pitch —
Configuration Modes JTAG, Active Serial (AS), Passive Serial (PS) —
RoHS-Status Lead-free / RoHS compliant (N suffix) Compliant (Pb-free, lead-free reflow compatible)
Series — Cyclone II
Logic Elements (LEs) — 8,256
Embedded Memory Bits — 165,888 bits
Total RAM Bits — 165,888
Logic Blocks / Logic Cells — 540 (Logic Cells)
User I/O Pins — 182
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers — Up to 36
PLLs — 2
Global Clock Networks — 16
I/O Supply Voltage — 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Package Type — 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Betriebstemperatur — -40C to +85C (industrial)
Configuration Method — SRAM, loaded from external EPCS flash at power-up
Montageart — Surface Mount (BGA)

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