EP2C8F256I8N vs EP2C8F256C7 Vergleich
Detaillierter Direktvergleich von EP2C8F256I8N von Intel und EP2C8F256C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2C8F256C7 - Cyclone II FPGA, 8K LEs, 256-FBGA | Intel
EP2C8F256C7 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2C8F256I8N | EP2C8F256C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,95 | $18,20 |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Betriebstemperatur | -40C to +85C (industrial) | 0C to +85C (commercial, TJ) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| RoHS-Status | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: RoHS status] |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 8,256 |
| Embedded Multipliers | — | 36 (18x18) |
| Number of Logic Array Blocks (LABs) | — | 516 |
| Maximum User I/O | — | 182 |
| Number of PLLs | — | 2 |
| Gehäuse | — | 256-LBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C7 (commercial, 7th bin) |