EP2C8F256I8N vs EP2C8F256C7 Comparación
Comparación detallada lado a lado de EP2C8F256I8N por Intel y EP2C8F256C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C8F256I8N | EP2C8F256C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,95 | $18,20 |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | 0C to +85C (commercial, TJ) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Estado RoHS | Compliant (Pb-free, lead-free reflow compatible) | [DATA_NEEDED: RoHS status] |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 8,256 |
| Embedded Multipliers | — | 36 (18x18) |
| Number of Logic Array Blocks (LABs) | — | 516 |
| Maximum User I/O | — | 182 |
| Number of PLLs | — | 2 |
| Encapsulado | — | 256-LBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C7 (commercial, 7th bin) |