EP2C8F256I8N vs EP2C8F256I6N Vergleich

Detaillierter Direktvergleich von EP2C8F256I8N von Intel und EP2C8F256I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C8F256I8N EP2C8F256I6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $21,95 $22,85
Series Cyclone II —
Logic Elements (LEs) 8,256 —
Embedded Memory Bits 165,888 bits —
Total RAM Bits 165,888 —
Logic Blocks / Logic Cells 540 (Logic Cells) —
User I/O Pins 182 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Embedded 18x18 Multipliers Up to 36 —
PLLs 2 —
Global Clock Networks 16 —
Core Supply Voltage 1.2 V 1.2 V (1.15 V min, 1.25 V max)
I/O Supply Voltage 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) —
Process Technology 90 nm CMOS (SRAM-based) 90 nm CMOS
Package Type 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch —
Betriebstemperatur -40C to +85C (industrial) —
Configuration Method SRAM, loaded from external EPCS flash at power-up —
RoHS-Status Compliant (Pb-free, lead-free reflow compatible) Lead-free / RoHS compliant (N suffix)
Montageart Surface Mount (BGA) —
Family — Cyclone II
Logic Elements — 8,256
Logic Array Blocks (LABs) — 540
Embedded Memory (M4K blocks) — 165,888 bits
Embedded 18 x 18 Multipliers — 36
Maximum User I/O Pins — 182
Phase-Locked Loops (PLLs) — 4
Maximum Internal Clock Frequency — 402.58 MHz
Speed Grade — 6
Operating Temperature (Industrial) — -40 C to +100 C (Tj)
Gehäuse — 256-ball FineLine BGA (FBGA-256), 1.00 mm pitch
Configuration Modes — JTAG, Active Serial (AS), Passive Serial (PS)

Datenblätter & Ressourcen

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