EP2C8F256I8N vs EP2C8F256I8 Vergleich
Detaillierter Direktvergleich von EP2C8F256I8N von Intel und EP2C8F256I8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2C8F256I8N | EP2C8F256I8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,95 | $36,53 |
| Series | Cyclone II | Cyclone II |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | [DATA_NEEDED: VCCINT voltage] |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | — |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Betriebstemperatur | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| RoHS-Status | Compliant (Pb-free, lead-free reflow compatible) | Unknown - no N suffix; verify in distributor data |
| Montageart | Surface Mount (BGA) | — |
| Logic Elements | — | 8,256 |
| Number of User I/O | — | 182 |
| Number of LABs / CLBs | — | 516 |
| Gehäuse | — | 256-LBGA (FBGA-256) |
| Number of Terminals / Balls | — | 256 |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial (suffix 'I') |
| Speed Grade | — | 8 (per suffix) |
| I/O Standard Support | — | [DATA_NEEDED: Supported I/O standards] |
| Number of PLLs | — | [DATA_NEEDED: Number of PLLs] |
| Configuration Methods | — | [DATA_NEEDED: AS / PS / JTAG support details] |