EP2S130F1020C3NGA vs EP2S130F1020I4 Vergleich

Detaillierter Direktvergleich von EP2S130F1020C3NGA von Intel und EP2S130F1020I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2S130F1020C3NGA EP2S130F1020I4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $1.395,00
Family Stratix II Stratix II
Logic Elements (LE) 132,540 —
Logic Array Blocks (LABs) 6,627 —
Embedded Memory (TriMatrix) 6,747,840 bits (6.7 Mbits) —
Embedded DSP Blocks Yes (18x18 multiplier blocks) —
User I/Os 742 —
Process Technology 90 nm —
Core Voltage 1.2 V —
Maximum Internal Clock Frequency 778.82 MHz —
Gehäuse 1020-ball FC-FBGA 1020-ball FC-FBGA (33x33 mm)
Speed Grade C3 I (industrial performance)
Temperature Grade Commercial (0C to +85C) —
PLLs 12 (8 fast PLLs + 4 enhanced PLLs) —
Configuration Modes PS, PPS, PPA, JTAG —
Configuration Encryption 128-bit AES —
RoHS-Status [DATA_NEEDED: rohs status] Compliant (per distributor listings)
On-chip Termination (OCT) Yes (series, parallel, dynamic) —
Logic Elements — 132,540
Equivalent LEs — ~180,000
Adaptive Logic Modules (ALMs) — 53,016
Embedded Memory (bits) — 6,747,840
Embedded Memory (M512 blocks) — 530
Embedded Memory (M4K blocks) — 768
Embedded Memory (M-RAM blocks) — 4
Embedded 18x18 Multipliers — 504
DSP Blocks — 48
User I/O Pins — 742
User I/O Banks — 12
Process Node — 90 nm CMOS, all-layer copper
Core Voltage (VCCINT) — 1.2 V
Device Revision — 4
Betriebs-Sperrschichttemperatur — -40C to +100C (industrial)
Configuration Scheme — Fast Passive Parallel x8, Passive Serial, JTAG
Montageart — Surface Mount (FC-FBGA)

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