EP2S130F1020C3NGA vs EP2S130F1020I4 Comparación
Comparación detallada lado a lado de EP2S130F1020C3NGA por Intel y EP2S130F1020I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S130F1020C3NGA | EP2S130F1020I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.395,00 |
| Family | Stratix II | Stratix II |
| Logic Elements (LE) | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | — |
| Embedded Memory (TriMatrix) | 6,747,840 bits (6.7 Mbits) | — |
| Embedded DSP Blocks | Yes (18x18 multiplier blocks) | — |
| User I/Os | 742 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | — |
| Maximum Internal Clock Frequency | 778.82 MHz | — |
| Encapsulado | 1020-ball FC-FBGA | 1020-ball FC-FBGA (33x33 mm) |
| Speed Grade | C3 | I (industrial performance) |
| Temperature Grade | Commercial (0C to +85C) | — |
| PLLs | 12 (8 fast PLLs + 4 enhanced PLLs) | — |
| Configuration Modes | PS, PPS, PPA, JTAG | — |
| Configuration Encryption | 128-bit AES | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant (per distributor listings) |
| On-chip Termination (OCT) | Yes (series, parallel, dynamic) | — |
| Logic Elements | — | 132,540 |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | — | 1.2 V |
| Device Revision | — | 4 |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |
| Tipo de montaje | — | Surface Mount (FC-FBGA) |