EP2S130F780I4N vs EP2S130F780C5 Vergleich
Detaillierter Direktvergleich von EP2S130F780I4N von Intel und EP2S130F780C5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S130F780I4N | EP2S130F780C5 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $210,00 | $2.295,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 132,540 |
| Equivalent LEs (max) | Approx. 132,540 (density class up to 180k) | — |
| LABs/CLBs | 6,627 | — |
| Embedded Memory (bits) | 6,748,160 | 6,737,280 |
| Total RAM Bits | 6,748,160 | — |
| Maximum User I/Os | 534 | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Number of PLLs | 16 | — |
| Process Technology | 90 nm CMOS (1.2 V, all-layer copper) | 90 nm CMOS |
| Core Voltage VCCINT | 1.2 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-rail) | — |
| Maximum Internal Frequency | 711.24 MHz | — |
| Gehäuse | 780-ball FC-FBGA (FineLine BGA), 29x29 mm, 1.0 mm pitch | 780-FBGA (FC-FBGA), 29 mm x 29 mm |
| Operating Temperature (Case) | -40C to +100C (Industrial, I4 suffix) | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant (lead-free) | — |
| Logic Array Blocks (LABs) | — | 6627 |
| User I/O Count | — | 534 |
| Embedded 18x18 Multipliers | — | 252 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V (typ. 1.2 V) |
| Internal Clock Frequency (max) | — | 609.76 MHz |
| Speed Grade | — | C5 |
| Betriebstemperatur | — | 0 C to +85 C (TJ) |
| Lead-Free / RoHS | — | Lead Free / RoHS Compliant |
| Configuration Interface | — | JTAG (IEEE 1149.1) + Passive Serial / Fast Passive Parallel |
| DSP Performance | — | Up to ~1.4 GMACs (per family datasheet) |