EP2S130F780I4N vs EP2S130F780C5 Comparação
Comparação detalhada lado a lado de EP2S130F780I4N por Intel e EP2S130F780C5 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2S130F780I4N | EP2S130F780C5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $210,00 | $2.295,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 132,540 |
| Equivalent LEs (max) | Approx. 132,540 (density class up to 180k) | — |
| LABs/CLBs | 6,627 | — |
| Embedded Memory (bits) | 6,748,160 | 6,737,280 |
| Total RAM Bits | 6,748,160 | — |
| Maximum User I/Os | 534 | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Number of PLLs | 16 | — |
| Process Technology | 90 nm CMOS (1.2 V, all-layer copper) | 90 nm CMOS |
| Core Voltage VCCINT | 1.2 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-rail) | — |
| Maximum Internal Frequency | 711.24 MHz | — |
| Encapsulamento | 780-ball FC-FBGA (FineLine BGA), 29x29 mm, 1.0 mm pitch | 780-FBGA (FC-FBGA), 29 mm x 29 mm |
| Operating Temperature (Case) | -40C to +100C (Industrial, I4 suffix) | — |
| Tipo de montagem | Surface Mount | — |
| Status RoHS | Compliant (lead-free) | — |
| Logic Array Blocks (LABs) | — | 6627 |
| User I/O Count | — | 534 |
| Embedded 18x18 Multipliers | — | 252 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V (typ. 1.2 V) |
| Internal Clock Frequency (max) | — | 609.76 MHz |
| Speed Grade | — | C5 |
| Temperatura de operação | — | 0 C to +85 C (TJ) |
| Lead-Free / RoHS | — | Lead Free / RoHS Compliant |
| Configuration Interface | — | JTAG (IEEE 1149.1) + Passive Serial / Fast Passive Parallel |
| DSP Performance | — | Up to ~1.4 GMACs (per family datasheet) |