EP2S30F484I4N vs EP2S30F484C3 Vergleich

Detaillierter Direktvergleich von EP2S30F484I4N von Intel und EP2S30F484C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2S30F484I4N EP2S30F484C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $305,00 $620,00
Family Stratix II Stratix II
Logic Elements 33,880 33,880
Embedded Memory 1,369,728 bits —
User I/O Pins 342 —
Gehäuse 484-ball FineLine BGA (FBGA) 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch
Ball Pitch 1.0 mm —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V (refer to datasheet) 1.20 V
Operating Temperature Grade Industrial -40C to +100C —
Lead-Free / RoHS Yes (N suffix indicates lead-free RoHS) —
Speed Grade 4 C3
On-Chip DSP Blocks Yes (dedicated 9x9/18x18/36x36 multipliers) —
PLLs Yes (on-chip, refer to datasheet for count) —
Configuration Method Serial/parallel via Quartus II —
Montageart Surface Mount (BGA) Surface Mount
LABs / CLBs — 1,694
Total RAM Bits — 1,369,728
Number of User I/O — 342
Number of I/O Pins (Package) — 500
Operating Temperature (Max) — 85 C (Commercial)
Embedded Memory Type — TriMatrix (true dual-port, FIFO)
Embedded DSP Blocks — Yes
PLL Count — Multiple (per family datasheet)
RoHS-Status — [DATA_NEEDED: rohs status]

Datenblätter & Ressourcen

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