EP2S30F484I4N vs EP2S30F484C3 Comparación
Comparación detallada lado a lado de EP2S30F484I4N por Intel y EP2S30F484C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S30F484I4N | EP2S30F484C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $305,00 | $620,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 33,880 | 33,880 |
| Embedded Memory | 1,369,728 bits | — |
| User I/O Pins | 342 | — |
| Encapsulado | 484-ball FineLine BGA (FBGA) | 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V (refer to datasheet) | 1.20 V |
| Operating Temperature Grade | Industrial -40C to +100C | — |
| Lead-Free / RoHS | Yes (N suffix indicates lead-free RoHS) | — |
| Speed Grade | 4 | C3 |
| On-Chip DSP Blocks | Yes (dedicated 9x9/18x18/36x36 multipliers) | — |
| PLLs | Yes (on-chip, refer to datasheet for count) | — |
| Configuration Method | Serial/parallel via Quartus II | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| LABs / CLBs | — | 1,694 |
| Total RAM Bits | — | 1,369,728 |
| Number of User I/O | — | 342 |
| Number of I/O Pins (Package) | — | 500 |
| Operating Temperature (Max) | — | 85 C (Commercial) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO) |
| Embedded DSP Blocks | — | Yes |
| PLL Count | — | Multiple (per family datasheet) |
| Estado RoHS | — | [DATA_NEEDED: rohs status] |