EP2S30F672C3 vs EP2S30F672C5 Vergleich
Detaillierter Direktvergleich von EP2S30F672C3 von Intel und EP2S30F672C5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S30F672C3 | EP2S30F672C5 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $780,00 | $155,00 |
| Series | Stratix II | — |
| Number of Logic Elements | 33,880 | — |
| Number of Adaptive Logic Modules (ALMs) | 13,560 | — |
| Total Embedded Memory Bits | 1,369,728 | — |
| Embedded Memory (M512 / M4K / M-RAM blocks) | M512, M4K, M-RAM TriMatrix | — |
| Total RAM Bits | 1,369,728 | 1,369,728 |
| Number of User I/O | 500 | — |
| Number of Transceivers | [DATA_NEEDED: depends on variant - up to 12] | — |
| DSP Blocks | Dedicated 18x18 multipliers | — |
| DSP Performance | Up to 156 GMACs | — |
| Voltage - Supply | 1.2 V core, multi-rail I/O | — |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Speed Grade | -3 | C5 (moderate-speed bin) |
| Gehäuse / Bauform | 672-BBGA, FCBGA (FineLine BGA) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| RoHS-Status | Non-compliant (leaded BGA) | [DATA_NEEDED: confirmed RoHS compliance] |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | Stratix II |
| Logic Elements | — | 33,880 |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded Multipliers (DSP blocks) | — | 12 DSP blocks |
| Maximum User I/Os | — | 500 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| Gehäuse | — | 672-pin FC-FBGA (flip-chip) |
| Operating Temperature (Commercial) | — | 0C to 85C junction |
| Speichertyp | — | TriMatrix (M512 / M4K / M-RAM) |