EP2S30F672C3 vs EP2S30F672C5 Comparación
Comparación detallada lado a lado de EP2S30F672C3 por Intel y EP2S30F672C5 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S30F672C3 | EP2S30F672C5 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $780,00 | $155,00 |
| Series | Stratix II | — |
| Number of Logic Elements | 33,880 | — |
| Number of Adaptive Logic Modules (ALMs) | 13,560 | — |
| Total Embedded Memory Bits | 1,369,728 | — |
| Embedded Memory (M512 / M4K / M-RAM blocks) | M512, M4K, M-RAM TriMatrix | — |
| Total RAM Bits | 1,369,728 | 1,369,728 |
| Number of User I/O | 500 | — |
| Number of Transceivers | [DATA_NEEDED: depends on variant - up to 12] | — |
| DSP Blocks | Dedicated 18x18 multipliers | — |
| DSP Performance | Up to 156 GMACs | — |
| Voltage - Supply | 1.2 V core, multi-rail I/O | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | — |
| Speed Grade | -3 | C5 (moderate-speed bin) |
| Encapsulado / Carcasa | 672-BBGA, FCBGA (FineLine BGA) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Estado RoHS | Non-compliant (leaded BGA) | [DATA_NEEDED: confirmed RoHS compliance] |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Stratix II |
| Logic Elements | — | 33,880 |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded Multipliers (DSP blocks) | — | 12 DSP blocks |
| Maximum User I/Os | — | 500 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| Encapsulado | — | 672-pin FC-FBGA (flip-chip) |
| Operating Temperature (Commercial) | — | 0C to 85C junction |
| Tipo de memoria | — | TriMatrix (M512 / M4K / M-RAM) |