EP2S90F1508I4 vs EP2S90F1508C5N Vergleich
Detaillierter Direktvergleich von EP2S90F1508I4 von Intel und EP2S90F1508C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2S90F1508I4 | EP2S90F1508C5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.525,10 | $3.780,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 90,960 | 90,960 |
| Adaptive Logic Modules (ALMs) | 45,960 | — |
| Total Embedded Memory Bits | 4,520,488 (~4.5 Mbits) | — |
| Embedded Multipliers (18x18) | 36 | — |
| DSP Blocks | 12 | — |
| User I/O Pins | 902 | — |
| Gehäuse | 1508-BBGA, FCBGA (FineLine BGA) | 1508-Ball FCBGA (FC-FBGA) |
| Betriebstemperatur | -40C to +100C (Industrial, I4 grade) | — |
| Core Voltage | 1.2 V (typical) | — |
| Process Technology | 90 nm CMOS | 90 nm |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Configuration Method | Passive Serial, Fast Passive Parallel, JTAG | — |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: rohs_status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Array Blocks (LABs) | — | 4,548 |
| User I/Os | — | 902 |
| Total Memory Bits | — | 4,520,488 |
| Operating Frequency Max | — | 609.76 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | Commercial (C) |
| Speed Grade | — | 5 |
| Configuration Memory | — | SRAM-based, external flash support |