EP2S90F1508I4 vs EP2S90F1508C5N Comparación
Comparación detallada lado a lado de EP2S90F1508I4 por Intel y EP2S90F1508C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S90F1508I4 | EP2S90F1508C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.525,10 | $3.780,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 90,960 | 90,960 |
| Adaptive Logic Modules (ALMs) | 45,960 | — |
| Total Embedded Memory Bits | 4,520,488 (~4.5 Mbits) | — |
| Embedded Multipliers (18x18) | 36 | — |
| DSP Blocks | 12 | — |
| User I/O Pins | 902 | — |
| Encapsulado | 1508-BBGA, FCBGA (FineLine BGA) | 1508-Ball FCBGA (FC-FBGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I4 grade) | — |
| Core Voltage | 1.2 V (typical) | — |
| Process Technology | 90 nm CMOS | 90 nm |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Configuration Method | Passive Serial, Fast Passive Parallel, JTAG | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: rohs_status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Array Blocks (LABs) | — | 4,548 |
| User I/Os | — | 902 |
| Total Memory Bits | — | 4,520,488 |
| Operating Frequency Max | — | 609.76 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | Commercial (C) |
| Speed Grade | — | 5 |
| Configuration Memory | — | SRAM-based, external flash support |