EP2SGX30CF780C5N vs EP2SGX30CF780I3 Vergleich
Detaillierter Direktvergleich von EP2SGX30CF780C5N von Intel und EP2SGX30CF780I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX30CF780C5N | EP2SGX30CF780I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $160,00 | $171,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 30,560 (33,880 logic cells) | — |
| LABs/CLBs | 1694 | — |
| Total RAM Bits | 1,369,728 bits | — |
| Number of I/Os | 361 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Frequency (max) | 609.76 MHz | — |
| Speed Grade | C5 (-5 internal speed bin) | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Gehäuse | FBGA-780 (29 x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead-Free | Yes (per datasheet) | — |
| JEDEC Package Outline | MS-034AAM-1 | — |
| RoHS-Status | Compliant (per Intel product page) | [DATA_NEEDED: RoHS status not confirmed in supplied data] |
| Logic Cells | — | 33,880 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Number of User I/O Pins | — | 361 |
| Transceivers | — | Embedded multi-gigabit transceivers (6.375 Gbps) |
| Terminal Pitch | — | 1.0 mm |
| Betriebstemperatur | — | -40 °C to +85 °C (Industrial) |
| Temperature Grade Suffix | — | I3 (Industrial) |
| Total Terminals | — | 780 |
| Package Code | — | BGA, square shape |