EP2SGX30CF780C5N vs EP2SGX30CF780I3 Comparaison
Comparaison détaillée côte à côte de EP2SGX30CF780C5N par Intel et EP2SGX30CF780I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2SGX30CF780C5N | EP2SGX30CF780I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $160,00 | $171,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 30,560 (33,880 logic cells) | — |
| LABs/CLBs | 1694 | — |
| Total RAM Bits | 1,369,728 bits | — |
| Number of I/Os | 361 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Frequency (max) | 609.76 MHz | — |
| Speed Grade | C5 (-5 internal speed bin) | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Boîtier | FBGA-780 (29 x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Lead-Free | Yes (per datasheet) | — |
| JEDEC Package Outline | MS-034AAM-1 | — |
| Statut RoHS | Compliant (per Intel product page) | [DATA_NEEDED: RoHS status not confirmed in supplied data] |
| Logic Cells | — | 33,880 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Number of User I/O Pins | — | 361 |
| Transceivers | — | Embedded multi-gigabit transceivers (6.375 Gbps) |
| Terminal Pitch | — | 1.0 mm |
| Température de fonctionnement | — | -40 °C to +85 °C (Industrial) |
| Temperature Grade Suffix | — | I3 (Industrial) |
| Total Terminals | — | 780 |
| Package Code | — | BGA, square shape |