EP2SGX30CF780C6 vs EP2SGX30CF780C3N Vergleich

Detaillierter Direktvergleich von EP2SGX30CF780C6 von Intel und EP2SGX30CF780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX30CF780C6 EP2SGX30CF780C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $165,00 $195,00
Family Stratix II GX —
Series EP2SGX Stratix II GX
Logic Elements (LE) 33,880 —
Adaptive Logic Modules (ALM) 13,540 —
Embedded Memory Bits 1,369,728 bits (171 KBytes) —
Embedded Multiplier 18x18 64 (estimated, datasheet required for exact count) —
User I/O Pins 361 —
High-Speed Transceivers Up to 8 channels (FPGA-dependent configuration) —
Transceiver Data Rate Up to 6.375 Gbps —
Gehäuse 780-ball FineLine BGA (F780) —
Speed Grade C6 (commercial, mid-speed) —
Betriebstemperatur 0C to +85C (commercial) 0C to +85C (commercial)
Core Voltage 1.2 V (typical) 1.2 V
Configuration Mode Enhanced passive/active (EPC) supported —
Process Technology 90 nm 90 nm CMOS
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: not stated in retrieved web snippets]
Lead-Free [DATA_NEEDED: lead-free status] [DATA_NEEDED: not stated in retrieved web snippets]
Number of Logic Elements — 33,880
Number of CLBs — 33,880
Maximum Operating Frequency — 717 MHz
Anzahl der Pins — 780
Package Type — 780-BGA (FC-FBGA)
Montageart — Surface Mount
Number of Transceivers — [DATA_NEEDED: transceiver count per family datasheet]
Embedded Memory — TriMatrix (M512/M4K/M-RAM blocks)
Total Embedded RAM — ~1.4 Mbit
DSP Blocks — 18-bit x 18-bit dedicated multipliers
Configuration Modes — PS, FPP, JTAG
Number of User I/O — [DATA_NEEDED: pin count varies by package; ~600 typical for 780-BGA]
Supply Voltage Range — [DATA_NEEDED: full VTT/VCCIO not stated in retrieved web snippets]

Datenblätter & Ressourcen

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