EP2SGX30CF780C6 vs EP2SGX30CF780C3N 对比
详细并排对比 EP2SGX30CF780C6 出自 Intel 和 EP2SGX30CF780C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX30CF780C6 | EP2SGX30CF780C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $165.00 | $195.00 |
| Family | Stratix II GX | — |
| Series | EP2SGX | Stratix II GX |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| 封装 | 780-ball FineLine BGA (F780) | — |
| Speed Grade | C6 (commercial, mid-speed) | — |
| 工作温度 | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm CMOS |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not stated in retrieved web snippets] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: not stated in retrieved web snippets] |
| Number of Logic Elements | — | 33,880 |
| Number of CLBs | — | 33,880 |
| Maximum Operating Frequency | — | 717 MHz |
| 引脚数 | — | 780 |
| Package Type | — | 780-BGA (FC-FBGA) |
| 安装类型 | — | Surface Mount |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family datasheet] |
| Embedded Memory | — | TriMatrix (M512/M4K/M-RAM blocks) |
| Total Embedded RAM | — | ~1.4 Mbit |
| DSP Blocks | — | 18-bit x 18-bit dedicated multipliers |
| Configuration Modes | — | PS, FPP, JTAG |
| Number of User I/O | — | [DATA_NEEDED: pin count varies by package; ~600 typical for 780-BGA] |
| Supply Voltage Range | — | [DATA_NEEDED: full VTT/VCCIO not stated in retrieved web snippets] |