EP2SGX30CF780C6 vs EP2SGX30CF780I3 Vergleich

Detaillierter Direktvergleich von EP2SGX30CF780C6 von Intel und EP2SGX30CF780I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2SGX30CF780C6 EP2SGX30CF780I3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $165,00 $171,00
Family Stratix II GX Stratix II GX
Series EP2SGX —
Logic Elements (LE) 33,880 —
Adaptive Logic Modules (ALM) 13,540 —
Embedded Memory Bits 1,369,728 bits (171 KBytes) —
Embedded Multiplier 18x18 64 (estimated, datasheet required for exact count) —
User I/O Pins 361 —
High-Speed Transceivers Up to 8 channels (FPGA-dependent configuration) —
Transceiver Data Rate Up to 6.375 Gbps —
Gehäuse 780-ball FineLine BGA (F780) 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch)
Speed Grade C6 (commercial, mid-speed) —
Betriebstemperatur 0C to +85C (commercial) -40 °C to +85 °C (Industrial)
Core Voltage 1.2 V (typical) 1.2 V
Configuration Mode Enhanced passive/active (EPC) supported —
Process Technology 90 nm 90 nm CMOS
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status not confirmed in supplied data]
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Cells — 33,880
Logic Array Blocks (LABs) — 33,880
Maximum Internal Frequency — 622.08 MHz
Number of User I/O Pins — 361
Transceivers — Embedded multi-gigabit transceivers (6.375 Gbps)
Terminal Pitch — 1.0 mm
Temperature Grade Suffix — I3 (Industrial)
Montageart — Surface Mount (BGA)
Total Terminals — 780
Package Code — BGA, square shape

Datenblätter & Ressourcen

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