EP2SGX30CF780C7 vs EP2SGX30CF780C6 Vergleich

Detaillierter Direktvergleich von EP2SGX30CF780C7 von Intel und EP2SGX30CF780C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX30CF780C7 EP2SGX30CF780C6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $171,00 $165,00
Series Stratix II GX EP2SGX
Logic Elements 33,000 —
Embedded Memory 1.9 Mbits —
DSP Blocks (18x18 multipliers) 256 —
Maximum User I/O 361 —
Multi-Gigabit Transceivers 4 channels —
Transceiver Data Rate 600 Mbps to 3.125 Gbps Up to 6.375 Gbps
PLLs 4 —
Core Voltage 1.2 V 1.2 V (typical)
Process Technology 90 nm 90 nm
Gehäuse 780-ball FineLine BGA (CF780) 780-ball FineLine BGA (F780)
Ball Pitch 1.0 mm —
Speed Grade C7 (fastest commercial) C6 (commercial, mid-speed)
Betriebstemperatur 0C to +85C (commercial) 0C to +85C (commercial)
Configuration Modes Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG —
RoHS-Status Compliant (lead-free Fineline BGA) [DATA_NEEDED: RoHS status]
Family — Stratix II GX
Logic Elements (LE) — 33,880
Adaptive Logic Modules (ALM) — 13,540
Embedded Memory Bits — 1,369,728 bits (171 KBytes)
Embedded Multiplier 18x18 — 64 (estimated, datasheet required for exact count)
User I/O Pins — 361
High-Speed Transceivers — Up to 8 channels (FPGA-dependent configuration)
Configuration Mode — Enhanced passive/active (EPC) supported
Lead-Free — [DATA_NEEDED: lead-free status]

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