EP2SGX30CF780I3 vs EP2SGX30CF780C4 Vergleich
Detaillierter Direktvergleich von EP2SGX30CF780I3 von Intel und EP2SGX30CF780C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP2SGX30CF780I3 | EP2SGX30CF780C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $138,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | Yes (Stratix II GX integrated) |
| Gehäuse | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-BBGA (flip-chip) |
| Terminal Pitch | 1.0 mm | — |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) | — |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| RoHS-Status | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 33,880 |
| Embedded Memory Bits | — | 1,369,728 |
| Maximum User I/Os | — | 361 |
| LABs/CLBs | — | 1,694 |
| Maximum Operating Frequency | — | 732.1 MHz |
| Core Supply Voltage | — | 1.2 V |
| AEC-Q100 | — | Not applicable (FPGA, commercial/industrial) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| MSL-Level | — | [DATA_NEEDED: MSL level] |